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Board Level Shielding - SWIPE

SWIPE is a two-piece frame and cover board level shield designed for surface mount applications. The perimeter flange design provides structural support and is available with a PIC-Spot for pick & place automation. This unique shield design allows engineers design flexibility to create any size surface mount shield for prototypes which can easily transition to high volume production.

 

 

 

 

 
               

Features

  • PCB Interface Options

    3G offer a variety of through-hole and surface mount attachment methods to securely bond the board level shield to the circuit board. Locating pins are placed on the bottom of the shield frame and mate to holes on the PCB. Locating pins are required for wave solder application but are also recommended for surface mount applications.

    Alignment Pins

    Through-Hole Pin

    Pin w/Standoff

    Castellation Edge

    Knife Edge

  • Standard Pin Sizes

    Standard Pin Configurations

    Locating Pin

    W

    L

    Recommended PCB Hole
    T1 0.032” (0.81 mm) 0.045” (1.14 mm) 0.035” (0.89 mm)
    T2 0.045” (1.14 mm) 0.057” (1.45 mm) 0.050” (1.27 mm)
    T3 0.045” (1.14 mm) 0.085” (2.16 mm) 0.050” (1.27 mm)
    T4 0.045” (1.14 mm) 0.110” (2.79 mm) 0.050” (1.27 mm)
    T5 0.020” (0.51 mm) 0.025” (0.64 mm) 0.023” (0.58 mm)
    T6 0.045” (1.14 mm) 0.135” (3.43 mm) 0.050” (1.27 mm)
    T7 0.060” (1.52 mm) 0.160” (4.06 mm) 0.065” (1.65 mm)
    T8 0.030” (0.76 mm) 0.110” (2.79 mm) 0.033” (0.84 mm)
    T9 0.025” (0.64 mm) 0.020” (0.51 mm) 0.028” (0.71 mm)
    T10 0.040” (1.02 mm) 0.057” (1.45 mm) 0.045” (1.14 mm)
    T11 0.045” (1.14 mm) 0.098” (2.49 mm) 0.050” (1.27 mm)
    T12 0.025” (0.64 mm) 0.045” (1.14 mm) 0.028” (0.71 mm)

    Standard Through Hole Pins w/Standoff

    Locating Pin

    W

    L

    Recommended PCB Hole
    T1S 0.032” (0.81 mm) 0.045” (1.14 mm) 0.035” (0.89 mm)
    T2S 0.045” (1.14 mm) 0.057” (1.45 mm) 0.100” (2.54 mm)
    T3S 0.045” (1.14 mm) 0.085” (2.16 mm) 0.050” (1.27 mm)
    T4S 0.045” (1.14 mm) 0.110” (2.79 mm) 0.050” (1.27 mm)
    T5S 0.020” (0.51 mm) 0.025” (0.64 mm) 0.023” (0.58 mm)
    T6S 0.045” (1.14 mm) 0.135” (3.43 mm) 0.050” (1.27 mm)
    T7S 0.060” (1.52 mm) 0.160” (4.06 mm) 0.065” (1.65 mm)
    T8S 0.030” (0.76 mm) 0.110” (2.79 mm) 0.033” (0.84 mm)
    T9S 0.025” (0.64 mm) 0.020” (0.51 mm) 0.028” (0.71 mm)
    T10S 0.040” (1.02 mm) 0.057” (1.45 mm) 0.045” (1.14 mm)
    T11S 0.045” (1.14 mm) 0.098” (2.49 mm) 0.050” (1.27 mm)
    T12S 0.025” (0.64 mm) 0.045” (1.14 mm) 0.028” (0.71 mm)

    * Additional pin sizes are available upon request. Please consult 3G’s engineering team for assistance.

  • Tuning Holes and Trace Reliefs

    Additional Standard Design Features.

    Tuning Holes

    Trace Relief

  • Ventilation Holes

    Ventilation holes can be added to any shield cover or frame wall. 3G’s standard vent hole pattern uses an 0.100” diameter holes, but they are available in 0.080”, 0.060”, 0.040” diameter holes and the patterns can be varied to meet the customer’s requirement.

    Ventilation Holes

  • Additional Features

    Connector Staking

    Emboss

    Countersinks

    Thermal Pads

  • Cover Retention Options

    There are two distinct cover retention methods offered by 3G. Both cover styles offer superior cover to shield frame retention while offer excellent grounding and shielding performance.

    Dimple Retention Cover

    Segmented Finger Cover

  • Corner Configurations

    3G Shielding Specialties offers several standard corner options to choose from depending on your frequencies and application requirements.

    Tight Corner

    Split corner

    Welded corner

  • PIC-Spot

    The PIC-Spot is used for pick and place automation for higher volume applications. The PIC-Spot can be added to any board shield and is typically centered within the shield frame. This feature can be easy removed once the shield is soldered to printed circuit board.

    PIC- Spot

 

 

Part Width (A) Length (B) Height (A)
SWP-S-501F
SWP-S-501C		 0.750” (19.05mm) 1.375” (34.93mm) 0.190” (4.83mm)
SWP-S-502F
SWP-S-502C		 0.900” (22.86mm) 1.750” (44.45mm) 0.150” (3.81mm)
SWP-S-503F
SWP-S-503C		 1.000” (25.40mm) 1.000” (25.40mm) 0.100” (2.54mm)
SWP-S-504F
SWP-S-504C		 1.250” (31.75mm) 2.250” (57.15mm) 0.165” (4.19mm)
SWP-S-505F
SWP-S-505C		 1.500” (38.10mm) 1.500” (38.10mm) 0.225” (5.72mm)
SWP-S-506F
SWP-S-506C		 1.750” (44.45mm) 2.000” (50.80mm) 0.200” (5.08mm)
Material is 0.012” thick Tin Plated Steel Bright Finish.
If Nickel Silver material is preferred change 'S' in part number to 'N' (Example: SWP-N-501F and SWP-N-501C)

Material Selection Guide

The vast majority of board level shields are manufactured using Tin Plated Steel (Indoor Environments) or Nickel Silver (Harsh Environments). 3G builds millions of board level shields per year, and has the purchasing power to ensure the necessary raw materials are always in stock and available. Board level shields are also available in less common materials such as beryllium copper, phosphor bronze, copper, brass, stainless steel and mu-metal.


 

Material Available thicknesses Recommended use
Tin Plated steel 0.008”(0.2mm) Recommended for indoor environments where corrosion is not an issue.
  0.012” (0.3mm)
  0.016” (0.4mm)
  0.025” (0.6mm)
Nickel Silver 0.008” (0.2mm) Recommended for outdoor, military application where corrosion resistance is required.
  0.012” (0.3mm)
  0.016” (0.4mm)
  0.025” (0.6mm)
MuMetals 0.01” (0.25mm) Recommended for magnetic shielding.
  0.025” (0.6mm)
Stainless Steel 0.008” (0.2mm) Recommended for non-shielding, mechanical components.
  0.012” (0.3mm)
  0.016” (0.4mm)
Phosphor Bronze 0.005” (0.125mm) Recommended for products that require spring type functionality.
  0.008” (0.2mm)
Berrylium Copper 0.005” (0.125mm) Recommended for products that require spring type functionality and resistance to thermal relaxation.
  0.008 (0.2mm)
Copper 0.008” (0.2mm) Recommended for components used for heat transfer.
  0.012” (0.3mm)
  0.016” (0.4mm)
  0.025” (0.6mm)
iso certified
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